Understanding Package Crack Signatures in a Leadframe Semiconductor Package

Comparison in between Good and Oxidized Leadframe: a Case Study in Package Delamination Analysis

The new electrical conductive material, copper alloy, C194 in situ composite, has been developed for the application to leadframe, high field magnet and trolley wire. This material has a low cost, high thermal and electrical conductivity, easy fabrication and joining, and also has a wide range of attainable mechanical properties. In C194, copper is one of the core materials in producing leadfra...

THE EFFECT OF DELAMINATION BETWEEN MOLD COMPOUND AND Ni/Pd/Au LEADFRAME ON QFN PACKAGE

The susceptibility of QFN package to delamination, particularly in the area between the Ni/Pd/Au leadframe die pad and mold compound, has been a major concern to many IC manufacturers. The presence of a Ni/Pd/Au oxide layer on the leadframe of QFN packages was found to cause delamination at the die pad or mold compound interface. Delamination refers to the disbonding between a surface of the mo...

Package Auctions and Package Exchanges

2.5D and 3D Semiconductor Package Technology: Evolution and Innovation

The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electronics industry to maximize their products functionality. By integrating multiple die elements within a single package outline, product boards can be made significantly smaller than their forerunners and the ...

Meta-Analysis in R Using Package rmeta

Meta-Analysis means a statistical analysis on the results of their findings is to combine a large number of independent studies. Meta-Analysis software is needed to be done for convenience, Statistical Software for Meta-Analysis is available in many statistical packages available in the present study provide software R is for Meta-Analysis. First, a brief description of the Meta-Analysis, Stati...